Influence of Pre and Post Diode Laser Application on Microtensile Bond Strength of Etch and Bond and Self Etch Adhesives to Dentin: An in Vitro Study

Abstract

Introduction: Dentin bonding agents have indeed seen significant advancements in recent years, leading to improved performance and clinical outcomes in restorative dentistry. It has led to improved formulation, stronger and durable bonds, improved moisture tolerance and reduced sensitivity. The idea of using laser irradiation to enhance the bond of adhesive to dentin before polymerization is an interesting approach. This method aims to improve the penetration of the adhesive into dentinal tubules, potentially leading to stronger and more durable bonds.

Objectives: To evaluate and compare the influence of pre and post Diode laser application on micro tensile bond strength of etch and bond and self etch adhesives to dentin.

Methods: 96 extracted teeth will be stored in 10% neutral buffer formalin. Decoronation done. The prepared teeth were then randomly divided into 3 groups. Each of the groups were again sub divided into two groups. Group 1a and 1b: Etching and bonding with etch and bond and self etch adhesive was done without the use of laser. Group 2a: Irradiation with laser first followed by etching and bonding with etch and bond. Group 2b: etch and bond applied followed by irradiation with laser prior to curing. Group 3a: Laser irradiation first followed by bonding with self etch adhesives. Group 3b: Bonding with self etch adhesives followed by irradiation with laser prior to curing.  

Results: The mean micro tensile strength for Etch and Bond adhesives was found to be highest followed by self-etch adhesives. 

Conclusion:   Based on the results of the study, it can be concluded that using diode laser prior to curing after adhesive application resulted in higher micro tensile strength in both the adhesives (albeit higher for Etch & Bond)